Board of General Chairs
- Professor R A Mashelkar, National Research Professor, India
- Dr Ali Chirazi, Thermofischer, France
- Professor Giovanni Bruno, BAM, Germany
- Professor M Muruganant, Vice Chancellor, Indus University, India
Board of General Vice Chairs
- Professor Ken Lewtas, Lewtas Science & Technologies Ltd, U.K.
- Professor Jens Wenzel Andreasen, DTU, Denmark
- Professor B V R Chowdari, President, MRS Singapore
- Professor Paloma Fernández Sánchez, Uni. Complutense de Madrid, Spain
Board of Program Chairs
- Dr Daniel Gaude-Fugarolas, dgaude Prime Innovation SLU, Spain
- Professor Noriyoshi Matsumi, JAIST, Japan
- Dr Carlos Capdevila Montes, CENIM, Spain
Board of Publication Chairs
- Dr Ali Chirazi, Thermofischer, France
- Professor M Muruganant, Vice Chancellor, Indus University, India
- Professor Noriyoshi Matsumi, JAIST, Japan
- Professor Apparao M Rao, Clemson, USA
International Scientific Committee (Tentative)
Rows179
Australia
CSTEP, India
University of Texas, USA
DLS, U.K.
University of Tennessee, USA
IIT Madras, India
Indian Institute of Technology Kanpur,, India
IIT Chennai, India
Washington State University, USA
University of North Texas, USA
GIFT POSTECH, South Korea
Monash University, Australia
Cambridge University, U.K.
Washington State University, USA
CENIM-CSIC, Spain
CSIRO, Australia
EPFL, Switzerland
CEA Saclay, France
Univ of Strasbourg, France
CEA, France
Academia Sinica, Taiwan
Tohoku University, Japan
Tunisia
University of Basque Country, UPV/EHU, Spain
Harbin Institute of Technology, China
ICMCB Bordeaux, France
National University of Singapore, Singapore
University of North Texas, USA
Oak Ridge National Laboratory, USA
Indian Institute of Technology, Bombay, India
Penn State University, USA
Lille University, France
Ghent University, Belgium
Director of the Science Centre ASKLEPIOS of the Medical and Dental Engineering Centre for Research, Design and Production ASKLEPIOS Ltd in Gliwice, Poland
ICMCB Bordeaux, France
Leeds University, U.K.
Indian Institute of Science, India
IFW Dresden, Germany
ICMCB Bordeaux, France
Oak Ridge National Laboratory, USA
DSI, USA
Ohio State University, USA
FEI, Netherlands
Nagoya Institute of Tech, Japan
IIT Kanpur, India
Consultant, Spain
BAM, Germany
University of Texas at Dallas, USA
ULB, Belgium
ARCI, India
ICMCB-CNRS, France
Microalloyed Institute, USA
University of Cambridge, U.K.
Nanjing University of Aeronautics and Astronautics, China
PSI, Switzerland
University of Applied Sciences Upper Austria, Austria
University of Applied Sciences Upper Austria, Austria
Deakin University, Australia
Nano/Nano-structured Materials, Chile
The University of Hong Kong, Hong Kong
University of Cambridge, U.K.
Infineum, U.K.
International Institute of Green Materials, Josai International University, Japan
Australian National University, Australia
ETS, Canada
Institute of Plasma Research, India
Indian Institute of Science, India
Swansae Univ, U.K.
Universidad del País Vasco, Spain
University of Utah, USA
IFE, Norway
IIT Bombay, India
North Dakota State University, USA
North Dakota State University, USA
NIMS, Japan
Creganna, Sweden
Kagoshima Univ, Japan
Naval Research Lab, USA
Cornell University, USA
Louisiana State University, USA
University of Cambridge, U.K.
University of Pittsburgh, USA
University of Oslo, Norway
ICMCB Bordeaux, France
University of Manchester, U.K.
Korean Institute of Materials Sceince, South Korea
POSTECH, South Korea
Lewtas Science & Technologies, U.K.
East China University of Science and Technology, China
Jiangsu University of Science And Technology, China
Northwestern Polytechnical University, China
LANL, USA
National Metallurgical Laboratory, India
INSA Lyon, France
ICMCB Bordeaux, France
Indian Institute of Technology, Delhi, India
ICMCB Bordeaux, France
Thermocalc, USA
CENIM-CSIC, Spain
Saintgits College of Engineering, India
JAIST, Japan
University of Michigan, USA
Springer, India
Canadian Centre for Welding and Joining, Canada
University of Cambridge, U.K.
ICMCB Bordeaux, France
CENIM-CSIC, Spain
IGCAR, India
IIT Madras, India
Sri Sathya Sai Institute of Higher Learning, India
University of North Carolina, USA
GGSIPU, India
Harbin Institute of Technology, China
Northwestern University, USA
ENSAM, France
University of Sheffield, U.K.
IGCAR, India
Indus University, India
Nihon University, Japan
Modsonic Instruments Mfg.Co.(P) Ltd, India
Clemson University, USA
ICMCB Bordeaux, France
Welding Research Council, USA
Processing maps dot com, India
IIT Bombay, India
Nottingham Univ, U.K.
University of Texas at Dallas, USA
PSG College of Technology, India
Indian Institute of Science, India
Clemson University, USA
MAHATMA GANDHI INSTITUTE OF TECHNOLOGY, India
LD college of Engineering, India
Ryreson University, Canada
University of Oxford, U.K.
University of Cambridge, U.K.
ENSAM, France
IIT Chennai, India
University of Cambridge, U.K.
CEMES-CNRS, France
University of Manchester, U.K.
Australain National Univ, Australia
Tokyo Univ, Japan
Seol National Universtiy, South Korea
Indian Institute of Science, India
DSI, USA
IIT Kanpur, India
NIMS, Japan
Monash University, Australia
Sandvik, India
Ascometal CREAS, France
GE Energy, India
McMaster University, Canada
PSG College of Technology, India
Materials Modifications Inc, USA
GIFT, POSTECH, Korea, South
ARCI, India
ESIEE Paris, France
Joining and Welding Research Institute, Osaka University, Japan
Manchester University, U.K.
MRS, USA
Graduate school of science and technology, Kumamoto University, Japan
Lappeenranta University of Technology, Finland
Solvay, Belgium
Sri Sathya Sai Institute of Higher Learning, India
Sri Sathya Sai Institute of Higher Learning, India
Nanjing University of Aeronautics and Astronautics, China
Nanjing University of Aeronautics and Astronautics, China
Manchester Univ, U.K.
Wuhan University of Science and Technology, China
University of Leeds, U.K.
Shanghai University, China
Ruhr University, Germany
Nanyang Technological University, Singapore
National Tsing Hua University, Taiwan
Durham Univ, U.K.
Nanjing University of Aeronautics and Astronautics, Chile
Aerospace Research Institute of Materials and Processing Technology, China
Huaqiao University, China
Zoz Company, Germany